Allows programmable electronic chips to be programmed while installed in the complete system.
Allows engineering and manufacturing facilities to shorten the development cycle by integrating programming and testing into a single production phase.
Reduces the possibility of damaging leads of surface mount devices and damaging devices through electrostatic discharge (ESD).
Allows manufacturers to avoid delays not have to purchase preprogrammed chips from a chip vendor or distributor.
Apply code of design changes in the middle of a production run.
Allows use of the ATE to perform operations on ISP devices and integrate operations with normal production test flow.
