|
Tekmos Talks
A Newsletter for the Semiconductor Industry
November 2016
|
|
|
| Quick Links |
Tekmos Sale Representatives & Distributors
Applications for Tekmos Products:
- Automotive
- Industrial
- Military
- Medical
- Telecommunications
The following are standard generic microcontroller devices available from Tekmos.
If you need a similar product not listed, contact
Tekmos
:
Intel replacements by Tekmos
NXP replacements by Tekmos
NXP/Freescale replacements by Tekmos
TK68HC711B16 and B32
Flash Memories
Standard Products
TL74FCT280TQ
Intel, NXP and Freescale are registered trademarks by these respective companies.
|
|
|
|
Welcome to
Tekmos
Talks
November 2016. This month we will talk more about FPGA Conversions, talk about Tekmos' Temperature Forcing Probe, talk about creating an ad for EE Times and introduce an intern.
|
From the Desk of the President
|
Block RAM Design-Part 1
Specifications
This is the first of a series of articles documenting the design of a dual port, programmable mode, 18K RAM for use in FPGA replacements. Other articles will cover the bit design, word drivers, sense amps, and the timing generator.
The first step in any design process is determining the specifications of what you are to design. In leading edge memory design, the choice is obvious. Take what you did before, multiply the size by 4, and you have your new specifications.
For most custom RAM applications, memory compilers produce a perfectly acceptable result. You specify the memory size, and how wide each word is, the desired speed, the desired process, and run the compiler. You can be done within minutes.
In our case, we need a block RAM whose size can be programmed at personalization, and could even be changed by the user in their application. To get that type of flexibility, we must design our own RAM.
Since our customers will have already been using block RAMs in their FPGA based designs, our research starts with determining what the FPGA providers are doing. What are their block RAM sizes? What modes do they support? Are any of those modes covered by patents? Do I have to include the mode in the RAM design, or can I allow the customer to add that functionality in the form of a wrapper around the RAM built out of logic gates?
Fortunately, the FPGA companies have provided a wealth of technical information about their block RAMs and their operating modes. After reviewing everything, we decided to create a block RAM that looks a lot like the Xilinx 18K block RAM. This article will discuss the design as implemented in our 180nm process. While the core voltage in the 180nm process is nominally 1.8 volts, we have specified our RAM to also work with core voltages of 1.5 and 1.2 volts. We are looking more for functionality than for speed at the lower voltages.
The next article will discuss the bit design.
For more information on Tekmos products contact sales@tekmos.com
or call 512-342-9871
|
|
|
|
Temperature Forcing Probe
|
Tekmos Temperature Forcing Probe
The temperature forcing probe is a washing machine sized box with an adjustable arm extending from it. At the end of the arm is a small test chamber. The machine can generate a temperature controlled stream of air, with temperatures ranging from -65C up to 185C. The test chamber is placed over the part, and the air is used to either heat or cool the part. Then we can measure the parts performance at a given temperature. And it has an auxiliary thermocouple that can be placed on the part to precisely control the actual part temperature.
We do this for several reasons. When a new part comes out, we characterize its performance over the intended temperature range. Not only does this confirm the correct operation of the part, is also provides feedback for our design models. We also use the probe when we need to test production parts at temperature and do not have a temperature handler capable of working with a specific package. And finally, we use the probe for failure analysis when a customer reports a problem at a specific temperature.
One issue with the probe is that it will also heat the tester that holds the part. We have learned that the best solution is to use a small extender cable so that the part under test is not directly on the tester. In those cases, where the part must be on the tester, we use sheets of thermal rubber as a top insulator, and then put multiple layers of cardboard under that to protect the tester from overheating. We tried ceramic tiles at one point for the underlying insulation, under the belief that if they worked for the space shuttle, then they would work for us as well. But they did not work as well as the cardboard, and so that is what we use.
The temperature forcing probe is a strong asset allowing us to provide a superior product for our customers.
|
|
| close up of control panel |
|
|
Tekmos Ad on EE Times
|
For most of November, Tekmos is running a leaderboard ad on EETimes. This ad showcases our new FPGA conversion capability in which Tekmos is offering a reduced NRE if the design fits on one of our existing gate arrays. This ad compliments other ads we are currently running under Google AdWords.
This particular advertising campaign is attracting a lot of interest. Not only are we seeing a higher number of clicks, but the CTR (Click Trough Rate) is running in the 2% range, which is double the rate we see on other advertising campaigns.
This also marks the first time we have used leaderboard (banner) ads, and represents an experiment for us. Many, if not most, engineers use ad-blocking software that is effective at suppressing leaderboard ads. Thus, we had an internal debate as to the effectiveness of such an approach. And being engineers, we decided that the best way to determine effectiveness was to run an experiment. In a month, we will review the results, and modify our ad campaigns accordingly.
|
Inside Tekmos
|
Meet Intern Jaime Perez
How long have you been at Tekmos and what brought you here?
- I have been at Tekmos since September 21, 2016. I informed Kelsey Mehlhorn that I was interested in working in the semiconductor industry. She then referred me to her boss, Lynn Reed, who offered me the opportunity I have now.
What are your responsibilities here at Tekmos?
- My current responsibilities are to support senior engineering with characterization of cell libraries at Tekmos.
What are your favorite tasks or projects to work on here at Tekmos?
- My favorite task is the current one that I am working on at the moment, providing support and learning.
What project are you working on now?
- Since I have only been at Tekmos for a little under two months, I have not had the opportunity to take on multiple projects just yet but I am currently making the transition from logic simulation to IC layouts.
Please tell us about your professional and educational background.
- I am from Edinburg, TX and a Senior at Texas State University. I have a 3.0 GPA majoring in Electrical Engineering with a focus on Micro and Nano Systems and a minor in Applied Mathematics. Prior to Tekmos I was working as a Part-Time Sales Associate at The North Face Outlet and as an employee at Texas State Tubes working on the environmental safety of the San Marcos River. During my down time, I enjoy working out, playing tennis, being outdoors, and spending time with my friends and family in the area.
|
 |
|
Thank you for reading
Tekmos Talks. Call (512) 342-9871 or email
Sales for more information on our most recent "tape outs", to inquire about our Low Cost ASICs, FPGA Conversions and our other quality products. You can also fill out our new
Sample Order Form ,
Request Quotation or
Contact Us.
Please share any comments, compliments and or requests by taking part in our Customer Survey provided here for your convenience.
Tekmos' Unify for your SiP ,with continued innovation.
Sincerely,
Lynn Reed, President
7901 E. Riverside Dr. Bldg.2, Suite 150
Austin, TX 78744
Phone: (512) 342-9871
Fax: (512) 342-9873
|
|
|
|
|
