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Sony HT-AX7 Portable Theater System Makes Spatial Sound More Convenient
Sony Electronics announced the HT-AX7, a portable theater system with 360 Spatial Sound Mapping, that offers a new way to enjoy entertainment throughout the home. The new HT-AX7 Portable Theater System promises to offer a cinematic sound experience that goes behind what is possible with single omnidirectional designs. By simply placing the three-speaker system around a room, the HT-AX7 delivers a captivating audio experience to fill any space. Read More
WiiM Pro Music Streamer Receives "Roon Ready" Certification
The WiiM Pro, the versatile network audio streamer launched by Linkplay Technology in March 2023, has now received the coveted Roon Ready certification from Roon Labs. Through Roon Ready, the WiiM Pro expands its already extensive capabilities, which already include AirPlay 2, with a multi-room, multi-user networked audio platform featuring bit-perfect playback, DSD and PCM upsampling, multichannel support and Signal Path display. Read More
Resonado Partners with Parts Express to Make Res-Core Woofer Available Direct to Consumers
Resonado Labs announced that, for the first time ever, its technology is now available directly to the public. Previously, Resonado's high-performance racetrack drivers, featuring the proprietary Res-Core architecture, were exclusively offered to companies through licensed manufacturers. Meeting requests from speaker builders and developers, Resonado partnered with Parts Express to make the NW7 Gen 1 racetrack woofer directly available to the market. Read More
New Automotive-Qualified XENSIV MEMS Microphone with Analog Interface for Audio and Active Noise Cancelation Systems
For ANC systems with an analog interface, Infineon Technologies expanded its automotive microphone portfolio with the XENSIV MEMS microphone IM68A130A with a flat frequency response to frequencies below 10Hz. It builds on the successful launch of Infineon’s first automotive-qualified digital MEMS microphone, the IM67D130A, and combines the company’s automotive expertise with its technical know-how in high-end MEMS microphones. Read More
Live from the ALTI Expo 2023: Watch Paul Beckmann Explain How to Achieve High-Quality Voice Conferencing
Sponsored - Voice conferencing products are notoriously difficult to build. Even relatively basic designs require hours of testing and tuning to achieve a satisfying user experience. More advanced designs with microphone arrays and satellite microphones present tricky issues at both the hardware and software levels. In this talk, filmed live at the ALTI Expo 2023, DSP Concepts CTO Paul Beckmann discusses the challenges in making high-quality conferencing products and the key steps to achieving differentiation. Read More
Shokz Introduces OpenFit Open-Ear True Wireless Earphones with New Air Conduction Technology
Shokz, known for its patented open-ear bone conduction technology and headsets, announced OpenFit, the brand's first open-ear true wireless stereo earphones, made with its patented air conduction technology. Soon to launch globally, the new Shokz OpenFit TWS around the ear design leaves the inner ear open and features a new ultra-lightweight on-ear hybrid dynamic driver unit and DirectPitch technology to produce a full audio experience. Not a bone conduction product. Read More
Dolphin Design Unveils Innovative IP for Sound Classification Reducing Power Requirements by 99%
Dolphin Design, a semiconductor designer of power management, audio, and processing devices with in-house ASIC design services, announced the launch of WhisperExtractor, a mixed-signal technology for voice and audio-enabled SoCs, enabling voice and sound classification at a record µW level power budget. The new technology paves the way to breakthrough always-on voice user interface, real time speech-to-text, and always-on sound detection. Read More
Orchard Audio Introduces Starkrimson 150W Dual/Triple Mono GaN Audio Power Amplifier
Orchard Audio, the audio company founded by Leonid (Leo) Ayzenshtat that offers a unique modular and DIY approach to all its designs, has announced a new set of amplifiers based on its tested and proven GaN-based Starkrimson Amp Module. Following the enormous success of the Starkrimson Mono amplifier, Orchard Audio is introducing the Starkrimson Duo/Trio amplifiers - one is the Duo (dual mono) stereo amplifier, and the Trio a triple mono configuration, perfect for driving 2.1 systems or the front home theater channels. Read More
New Logitech G PRO X 2 Lightspeed Gaming Headset Drivers Powered by Ora Graphene
Logitech, the powerful Swiss public company and recognized global brand, has launched the new Logitech G PRO X 2 Lightspeed Wireless Gaming headphones with microphone, promoted as "the ultimate esports headset." This new model from the Logitech G gaming brand not only features some unique design optimizations and reduced weight for added comfort, but adds a superior reproduction component with the added benefits of a pure graphene driver from Ora Graphene. Read More
Editor's Desk
Roger Shively
(Shively Acoustics International
- APDA Modeling and Measurement Education Pillar Chair)
COMSOL and Klippel
Integration of Simulation and Measurement Data
Recently returned from Orlando, FL, where we attended another edition of the ALTI Expo & Conference (June 11-13, 2023), audioXpress invited me to summarize the content covered in a very important session that took place at this content-rich event.

This year, the Audio & Loudspeaker Technologies International (ALTI) Association joined forces with the Audio Product Development Alliance (APDA) to reinforce the educational aspects of the ALTI Expo & Conference. With a very strong schedule of sessions, presentations, and workshops, the APDA-ALTI Education Symposium 2023 covered Sourcing and Supply Chain topics on the first day, followed by a full day focused on the Modeling and Measurement experience, and extending into an education-only third day centered around Voice and DSP.

Modeling and Simulation has advanced greatly with the innovation in software tools brought to market by companies like COMSOL. Measurement systems today can and do collect vast amounts of data about product performance, quality, consistency, and more. The next frontier is bridging the gap between simulation data and measurement data.

Integrated in the APDA-ALTI program, a session promoted in cooperation between COMSOL and Klippel, two leading companies from both disciplines in the audio industry, offered an historical perspective about the Integration of Simulation and Measurement Data.
The Audio Product Development Alliance (APDA), in association with the Audio & Loudspeaker Technologies International (ALTI) Association, promoted a three-day education symposium focused on the development of audio products.
Minding the Gap
Mark Cops, an Applications Engineer with COMSOL, and Robert Werner, an Applications Engineer with Klippel, joined the effort to illustrate how to integrate loudspeaker measurements with simulation modeling. During the presentation, they discussed data management, comparison, and model updates for optimization, which is the most powerful part of the audio production simulation and production cycle.

In what is expected to be chapter one of many, Klippel demonstrated how a set of parameter measurements based on a nonlinear electro-dynamic model can fully define a linear and nonlinear lumped parameter model, with the goal of importing a table of parameters into a CAE simulation modeling software platform such as COMSOL to build a comparable simulation model for validating the model and the measurements.

The table of parameters from the Klippel measurements are applied to an equivalent lumped parameter model at the nodes in the CAD geometry, which are defined using COMSOL Multiphysics for the coupling of the electro-dynamic behavior. The parameter table is used in a COMSOL Function, which defines that lumped parameter model.
Simple diagram of the workshop goals to match simulation output and measurement results of an automotive electro-dynamic transducer, using a nonlinear lumped parameter model with monitored state variables and output metrics.
Figure 1: Electro-Mechanical Circuit Model and Acoustic Radiation Multiphysics.
A mechanical model for a speaker cone, surround, and dust cap was created for the acoustics radiation simulation. In the example presented, the parameter integration of the nonlinear electro-dynamic model was for low-frequencies only, representing the loudspeaker cone behavior in the pistonic range, where the radiating surface is not bending. However, the method could easily be expanded to the higher frequency range above the piston band for a full-range measurement and simulation model.

This case also represented a process that was initiated from the measurement of an existing loudspeaker design, from which the COMSOL model was generated. The reverse could also be possible. A new design generated in COMSOL using a full Multiphysics electro-magnetic model and electro-mechanical model coupled to acoustics radiation could produce the parameter table for the nonlinear electro-dynamic model for importing into Klippel. At that point a first prototype could be measured, and the results compared. Calibration of the simulation model in COMSOL could be made with updates from the Klippel measurement comparison until a validated model is available for both linear and nonlinear loudspeaker behavior.

The first procedural decision was to use either a Lumped or Distributed Model. For frequencies below the first bending mode of the loudspeaker cone, where the cone is considered a piston, the lumped model is useful. Above the first bending resonance, a distributed model is needed. For the first step in working to integrate measurement and simulation data, a lumped parameter model was used.
Figure 2: Calculation of Acoustic Ex-Situ Response.
The steps in measurement with Klippel began with a laser scan of the 3D cone geometry and capturing the distributed cone vibration. In this case, determining the pistonic frequency range and effective radiation area were key points of interest. The full nonlinear electro-dynamic model parameters were based on the circuit model shown in Figure 1.

The linear parameter measurement provides Impedance, Displacement, Bl, Inductance, and Moving Mass. The nonlinear parameter measurement provides the Bl(x) Force Factor, Kms(x) Suspension Stiffness, and L(x,i=0) Electrical Inductance curves expressed in power series coefficients. The large signal output measurements provide the “symptoms” (i.e., the influence of nonlinear distortion). This gives us the stepped voltage response and the harmonic distortion at higher voltage.

Sound pressure is measured in the near field and then corrected to an idealized standard free-field reference using Klippel’s holographic Near-Field Scanner (NFS) technology for sound field identification and direct sound separation as well as far field extrapolation. This removes the room and any baffle effects. The anechoic frequency response can be calculated as well as harmonics distortion, in what Klippel calls Acoustics Ex-Situ data (Figure 2).
Figure 3: COMSOL Model Builder Menu, completed in order from the top to the bottom.
The Integration Process
In general, the complementary process for COMSOL integrating measured data into its simulation model setup follows the same workflow that setting up a new model follows. Except that the parameters can be imported rather than manually input into the Global Definitions at the top of the COMSOL Model Builder menu (Figure 3). The workflow follows that menu from the top to the bottom: Parameter Import, Geometry Import, Physics, Mesh, Studies, and Results.

The linear and experimental data text files, along with the nonlinear data text file, are imported into COMSOL as parameters. An Analytic function is created under the Component Definitions in COMSOL for each of the nonlinear parameters, defined as a five coefficient power series (0-4) function. The geometry is imported from the DXF file from the laser scan. The 3D geometry is smooth and the 2D symmetry is used to reduce the Degrees of Freedom (DOFs) in the model, reducing solving time.

Then the physics models (Figure 1) are applied. The electric circuit interface solves a coupled system of differential equations for current through each device, and it is here that each of the nonlinear parameters are coupled. The equations are solved using Kirchoff’s conservation laws for the electrical circuit. And, then Pressure Acoustics are set up for solving the Helmholtz equation for acoustic pressure using the finite element method (Figure 4). The interior lumped loudspeaker boundary is created to fully couple the Pressure Acoustic physics to the Electrical Circuit lumped parameter model. The electrical current is passed as a velocity condition on both acoustic sides of the loudspeaker cone. Then finally the mesh is created. Studies are set up for results in the Frequency Domain, for Time Dependent solutions (harmonics), and for Eigenfrequencies.
Robert Werner (Senior R&D Engineer at Klippel GmbH) and Mark Cops (Applications Engineer at COMSOL) presenting during the ALTI Expo & Conference 2023.
In this case study, the linear model was solved first and compared to the Klippel results to confirm calibration of the model. Then the lumped speaker boundary was applied in the time domain to include the nonlinear large-signal parameters. In this study, Displacement and Pressure were solved for at 10V RMS. The second and third harmonics are also solved for at each individual frequency point at 10V RMS.

To close the loop with Klippel measurements, the results were compared (Figure 5). The difference in the third harmonic is due to the upper fundamental frequency for the COMSOL model. The mesh was refined for a fundamental upper frequency of 500Hz, and this was not defined enough for harmonics above the second. The last comparison between COMSOL and Klippel results was for the stepped voltage results for displacement (Figure 6).
Figure 4: COMSOL Pressure Acoustics Applied to the 2D axisymmetric model of the loudspeaker. Lumped Loudspeaker surface velocity and Perfectly Matched Layer, defining the Computational Domain.
What’s Next
COMSOL is looking forward to continuing the collaboration with Klippel to investigate parameter estimation for material properties of the cone for the higher frequency range. Klippel has begun the work on this front. In terms of integration for simulation and measurement data, COMSOL and Klippel went with a simple export and import for this round. Higher frequencies can follow this same process, or the reverse exchange of data from a model initiated in COMSOL can be done. Klippel has considered exporting its data as SPICE netlist, which is common for circuits. COMSOL can import this format and it would simplify creating the model. Or, COMSOL could develop an Add-in (method) specifically for reading in the Klippel .txt files for the circuit and automatically constructing the circuit interface in COMSOL. Depending on the actual need from customers who use both COMSOL and Klippel, a method could be created for them, and both companies are committed to doing so.

Any questions, comments or inquiries, send me an email.
Figure 5: Comparison of Modeled SPL Harmonics, 10V RMS at 1m from COMSOL (*) and Klippel (dashed).
Figure 6: Comparison of Modeled Displacement for Stepped Voltage from COMSOL (*) and Klippel (solid line).
Fresh From the Bench
The Hypex NCORE NCx500 Amplifier Module
Doubling Down on a Flagship
By Stuart Yaniger
This article was one of the most eagerly awaited reviews of a modern Class-D module amplifier. The new NCx500 amplifier board from Dutch manufacturer Hypex Electronics is the first of a new NCOREx family of modules that evolves from the extremely popular NCORE Class-D amplifier technology, one of the most successful options among high-end audio and studio monitor brands. Stuart Yaniger was able to spend a few weeks with this next flagship for OEM applications. How will this improved NCOREx technology measure up? And will it deliver the "x" times improvements over the proven NCORE? Stuart shares all the details. This article was originally published in audioXpress, May 2023. Read the Full Article Now Available Here
Voice Coil Patent Review
An Advanced Loudspeaker System
By James Croft
This article examines a notable patent application from VUE Audiotechnik, LLC (Escondido, CA), describing a loudspeaker system with one driver providing a direct radiating output from the front, and a second driver on a ported side chamber, sharing a ported common chamber, where at least one port of the ported common chamber exits the front of the loudspeaker system. In one embodiment, the common chamber includes at least one port that is substantially aligned with the front of the loudspeaker system. In another embodiment, each speaker is coupled to a separate amplifier and signal processing unit. As Croft notes, this is an innovative advanced system - that was patent-pending at the time, following amendments to the original claims - and provides a unique combination of technology, offering real-world advantages. The patent was finally granted in 2021. This article was originally published in Voice Coil, November 2017.  Read the Full Article Now Available Here
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