Overview of Semiconductor Manufacturing Dates: (1.5 day class)
The purpose of the course is to provide a comprehensive understanding of the semiconductor industry and the manufacturing process of an integrated circuit for new personnel entering the field or individuals looking for a well-rounded understanding of all the jargon, tools, and materials used in the process.
What the course covers:
Basic Electronics and Microelectronics Terms:
Definition of basic electronic terms and concepts
Overview of microelectronics and the role of integrated circuits
Define Process Nodes:
Explanation of process nodes and how they relate to device performance and cost
Device Physics and Transistor Operation:
Understanding of the physical principles behind device operation and the functioning of transistors
Crystal Growth and Wafer Prep:
Overview of crystal growth techniques used in semiconductor manufacturing
Explanation of wafer preparation techniques and materials used
FDSOI, FinFets, Gate all around (GAA) Transistors:
Explanation of these advanced transistor technologies and their impact on device performance
Circuit Design and Layout:
Overview of circuit design and layout techniques and tools used in semiconductor manufacturing
Mask Making/ Types of masks
Explanation of mask making techniques and materials used in lithography
Clean Rooms:
Overview of clean room environments and their importance in semiconductor manufacturing
Lithographic Techniques: DUV, Immersion, EUV
Plasma and Wet Etch:
Overview of plasma and wet etch and cleaning processes used in semiconductor Manufacturing
Ion Implantation:
Explanation of ion implantation techniques and their role in device fabrication
Diffusion:
Overview of diffusion techniques used in semiconductor
RTP, CVD, ALD, ALE:
Explanation of these advanced manufacturing techniques and their impact on device performance down to 3nm
Electro-Plating, Sputtering, CMP:
Overview of electro-plating, sputtering, and chemical mechanical polishing, CVD, CMP
Wafer Sort, Wire Bonding, Bumping:
Explanation of wafer sorting, wire bonding, and bumping techniques and their role in device packaging
Packaging Technology 3D Stacking, TSV, Wafer Level Packaging (WLP):
Conclusion:
This course provides a comprehensive overview of the semiconductor industry and the manufacturing process of an integrated circuit, helping new personnel entering the field or individuals seeking a better understanding of the industry to navigate the complex technologies and terminology used in the industry
Who Should Attend:
Anyone wanting an understanding of semiconductor manufacturing
Live Seminars and Webinar Dates and Locations
April 3-4,2023 Webinar for American Attendees
(Starts at 9:30am Central time)
($995 USD)
Will be using Zoom Platform
April 10-11,2023 Webinar for European Attendees
(Starts at 9:30am Munich, Germany time)
($995 USD)
Will be using Zoom Platform
June 5-6, 2023 Webinar for Asian Attendees
(Starts at 9:00am Taiwan time)
($995 USD)
Will be using Zoom Platform
June 26-27,2023 Webinar for American Attendees
(Starts at 9:30am Central time)
($995 USD)
Will be using Zoom Platform
In Person Seminars:
April 26-27, 2023/ Chandler, AZ/ Seminar/$1295 USD
May 8-9, 2023/ Santa Clara, CA/ Seminar $1295 USD
May 11-12, 2023/ Columbus, OH/ Seminar $1295 USD
May 22- 23, 2023/ Malta, NY/ Seminar $1295 USD
July 10-11, 2023/ San Francisco, CA/ Seminar $1295 USD (During SEMICON West week)
Introduction to Semiconductor Design and Fabrication Dates:
( 1 day class)
(Same class as above but shorter and intended for non-engineering people or employees new to the semiconductor industry)
May 4, 2023/ Webinar for American Attendees
(Starts at 9:30am Central time)
($845 USD)
Will be using Zoom Platform
In person seminars:
April 25, 2023/ Chandler, AZ/ Seminar/$845 USD
Instructor: Denny Frye
Reference:
I have known Denny for over 25 years, I was fortunate to have him come over and conduct SEMI Technology courses at Applied Materials, when I was Managing Dir. of the ET Institute there. He has an in-depth firsthand as well as academic knowledge of the subject, most of all his teaching/training style is most engaging and very easy to follow regardless of your own background knowledge.
On my return to Applied, a year back or so, I took the course with him to refresh myself and found his inimitable style most refreshing and knowledge enhancing. Thanks,
Regards,
Azmat Siddiqi
Quality Director at Applied Materials
Quote " This course is the most needed at Intel and the most important"
Dr. Michael Fors
Intel x Learning Chief Officer at Intel University
To Register or more information:
636 343-1333 in USA
