 New
MASS 300 VS
New PCB Selective Equipment
acquired to address the continuous demands pertaining to via hole
filling, through holes and blind vias.
Continuing our commitment to
reinvesting in our capabilities, we recently secured a brand new
MASS VHF 300 VS with Vacuum
Advantages
for Board Assembly:
� Selective Via Hole Filling of
through holes and blind vias
� Less waste from the very
valuable silver paste
� High paste pressure to fill
high aspect ratio (1:40) boards
� No direct contact between
compressed air and paste
� Heatable heads are
available
Pastes for this
Process:
Silver- and copper paste
(conductive)
Epoxy Fill (non conductive)
Sanei, Taiyo, Peters, Coates etc.
Function:
The pcb and stencil are placed
horizontally onto the filling  surface and clamped by the clamping
system.
The door is closed and the
vacuum process starts.
The vacuum has built up after
about 20 seconds.
The plunger (air pressure
controlled) is pressing the paste through the stencil into the
holes of the panel.
The paste is stored in reusable
cartridges. We supply different head�s for different panel
sizes.
The movement of the Y-axis is
controlled by a servo motor.
All process parameters are part
of the recipe.
The touch panel display allows
up to 50 recipes to be stored.
Paste
Delivery
As with the VCP vertical filling machines, the
paste delivery is from a standard 12oz or 6oz or smaller
cartridge.
The paste is pressed into the
via fill head via pneumatic pressure on the back of the plunger in
the cartridge.
Different head sizes can be
used.
If, however, a head size larger
than 6" is required, then the pressure bar assembly must be
exchanged against one that allows the capability of pressing a long
head up to 24" long evenly across the entire width of the fill
area.
Also, as with the vertical VCP machines, face plates with
different opening sizes can be used with a given head
size.
|
