Dr. Limin Zhou, Senior Director, Strategic Marketing, MRSI Systems, Mycronic Group and General Manager of MRSI Automation (Shenzhen) Co., Ltd to present “Discussion on photonics chip assembly technology, equipment and development trends” during the Optoelectronic Chip Design, Manufacturing and Packaging Technology Forum on September 8, 2022.

The growth of photonics chips in traditional and emerging application markets continues at a fast pace driven by the well-publicized need for greater data, better bandwidth, and faster speeds. The assembly technology and equipment of photonics chips have some specific advantages compared with traditional semiconductor chips. In this speech, Dr. Zhou will discuss the special requirements and new trends in photonics chip packaging. Some technical challenges in photonics chip assembly will be introduced, and the key technologies and MRSI’s related experimental results of photonics chips assembly will be shown. 

We are proud to announce that MRSI will be exhibiting at this year’s 24th China International Optoelectronic Exposition. This event will be held from September 7-9th at the Shenzhen World Exhibition and Convention center. 

MRSI will provide live product demos of the recently launched MRSI-H-HPLD+ along with various assembly technologies and solutions. The MRSI-H-HPLD+ is the latest advancement in the MRSI-H/HVM-series product lines. This new variant of the successful MRSI-H-HPLD, tailored for high power laser die attachment applications, significantly improves the throughput by using parallel processing while maintaining high accuracy and flexibility.