The MRSI-H3LD, a 3 micron high speed die bonder, optimized for bonding large dies for high power laser diodes, that are used in advanced photonics such as industrial lasers, optical fiber amplifications, lighting, and sensors.
High power laser diodes are critical components for multiple markets and have seen a significant, continual rise in adoption with the explosion in new applications. The MRSI-H3LD die bonder is equipped for speed with "on-the-fly" auto tool changer integrated on the bonding head, for zero time tool change-over with the ultrafast-ramp eutectic station for reduced cycle time. Combining both of these features, the MRSI-H3LD die bonder demonstrates the highest throughput in the industry for high power laser diode die bonding.
This product carries key technological building blocks from our field proven flexible high speed MRSI-HVM3 platform for industry leading throughput, superior flexibility, and future-proven 3 micron placement accuracy.
The accuracy is achieved without sacrificing high speed or flexibility and helps high power laser diode manufacturing to achieve smaller offset between the front facets of the laser diode and the front end surface of the submount. It is also equipped with self-leveling collets specially designed for large high power laser dies to achieve co-planarity between two bonded interfaces.
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