The September issue of PCB007 Magazine focuses on industry roadmaps and features an article based on the iNEMI Roadmap. The article, "Stringent High-speed Requirements Pose Technology Challenges,” is written by Tarja Rapala (EIPC) and Joe Beers (Gold Circuit Electronics), co-chairs of the Printed Circuit Board roadmap topic. The article, located on pages 20-31, focuses on high-speed PCBs and PCB substrates. It identifies technical needs, gaps and challenges in each of these areas and outlines potential solutions for some of the key issues. Read the article.
The full version of the iNEMI Printed Circuit Board roadmap topic is available online, along with mmWave Materials & Test, Smart Manufacturing, and Sustainable Electronics.Link to the iNEMI Roadmap.
iNEMI Participates in IPEF Critical Minerals Dialogue
The Indo-Pacific Economic Framework for Prosperity (IPEF) is a partnership among 14 countries committed to fuel inclusive, sustainable growth to create a stronger, fairer, more resilient economy for families, workers, and businesses in the United States and in the Indo-Pacific region. As part of this framework, the IPEF Critical Minerals Dialogue is focused on supporting U.S. expansion and development of the full critical mineral supply chain. Recycling and recovery of materials is one of four workstreams under the Critical Minerals Dialogue and, as part of this effort, the U.S. Department of State is reaching out to trade associations focused on critical mineral and e-waste recycling to present at these meetings and discuss their views on recycling of critical minerals, including the role of government.
Mark Schaffer, INEMI Project Manager and Sustainable Electronics Lead, was one of three presenters at the third technical experts meeting of the IPEF Critical Minerals Dialogue on Recycling and Recovery in September. In this virtual meeting, held September 10, Mark shared information about iNEMI’s efforts in sustainability and circularity. Read more.
Members — if you would like to get involved in planning iNEMI activities on sustainable electronics please contact Mark Schaffer (marks@inemi.org) about participating in the iNEMI Sustainable Electronics Technology Integration Group (TIG). The group meets monthly on the first Wednesday of the month at 11:00 a.m. to noon Eastern (U.S.).
UPCOMING EVENTS
iNEMI Session at IEMT(October 17; Penang, Malaysia) — If you plan to attend IEEE’s International Electronics Manufacturing Technology (IEMT) conference in Malaysia this October, be sure to join us for the iNEMI session — Session D1 iNEMI Special Track / Packaging Trend (10:30 a.m. — 12:10 p.m.). The session, chaired by Oooi Chun Keang (Intel), features the following presentations:
“Fine Pitch 2.5D & 3D Advance Packaging Assembly Using Thermal Compression Bonding for Chiplet Integration,” Samuel Goh (Kulicke & Soffa)
“Enhancing AOI with AI for Printed Circuit Board Assembly – A Comprehensive Industry Study,” Feng Xue (IBM)
“High Density Interconnect (HDI) Socket Dynamic Warpage Prediction via Mori-Tanaka Model,” Ooi Chun Keang (Intel)
“Recent iNEMI Research on Electromigration in Tin-Bismuth Solder,” Prabjit Singh (IBM) and Haley Fu (iNEMI)
Haley Fu (iNEMI) will be attending IEMT — email her (haley.fu@inemi.org) if you’d like to meet at the conference.
iNEMI Panel on Circularity at eSummit (October 22; Austin, Texas) — Mark Schaffer (iNEMI) will moderate an iNEMI panel at the Electronics Sustainability Summit(eSummit) entitled “There’s No End to a Circle: How to Address Circularity Challenges in Electronics Manufacturing.” The session is scheduled for 9:00-10:00 a.m. on Tuesday, October 22, and features panelists Kelly Scanlon, Lead Sustainability Strategist for IPC; Cassie Gruber, Director of Business Development for Jabil’s Scope 3 & Circular Solutions; and Rich Bulger, CEO of RecirQ, and author of Going Circular.
Circularity means that electronics manufacturers have systems and processes in place that address remanufacturing, recycling, reparability, reusability, upgradability, and resource efficiency. If you plan to attend this year’s eSummit, please join us for an open discussion about key challenges to, and opportunities for, implementing circular economy, and share with us the problems and solutions you are experiencing.
Mark will also be participating in another panel — Enabling Sustainability in the First Life of Electronics — on Wednesday, October 23 (2:00-245 p.m.). This panel will talk about practical challenges and how the industry is working to enable longer first use through extended warranties, support, software updates and increased durability. If you have any questions, need additional information about iNEMI’s sustainability initiatives, or would like to meet at the conference, please contact Mark Schaffer (marks@inemi.org).
iNEMI Presentations at SMTA International (October 20-24; Rosemont, Illinois USA) — If you plan to be at SMTA International this year, be sure to check out the following presentations from iNEMI project teams and the Technology Town Hall session we are co-hosting on Tuesday afternoon. In addition, iNEMI CTO Grace O’Malley (gomalley@inemi.org) will be at the conference. Send her an email if you’d like to meet.
Technology Town Hall, co-hosted by iNEMI, HDP and SMTA — Thermal Cycle vs Thermal Shock Testing of Solder Joints: Is there really a difference?
“The Effect of Thermal Cycling Dwell Time on Reliability of High-Performance Pb-free Solder Alloys,” Richard Coyle (Nokia Bell Labs)
“iNEMI Board Assembly-Press Fit Technology Roadmap of 2023 and 10 Years Beyond,” Paul Wang (MiTAC Computer Technology)
“A Comparison of Thermal Cycling and Thermal Shock for Evaluating Solder Joint Reliability,” Richard Coyle (Nokia Bell Labs)
“Thermal Cycling Hybrid, Homogeneous, and Resin Reinforced Low Temperature Solder Ball Grid Array Interconnects at a High Homologous Temperature,” Richard Coyle (Nokia Bell Labs)
“Microstructural Evolution During Electromigration in Eutectic Tin-Bismuth Bottom Terminated Components Solder Joints,” Prabjit Singh (IBM Corporation)
RESCHEDULED: End-of-Project Webinar: PCB Connector Footprint Tolerance (October 28) — iNEMI’s PCB Connector Footprint Tolerance Project investigated industry capability, risks and mitigation strategies associated with high-bandwidth I/O connector footprints. As bandwidth continues to double every three years, the reduction in connector pitch to 0.6mm imposes stringent design requirements on PCB fabrication processes. The project team aimed to provide product designers with the information necessary to ensure predictable quality levels when using high-bandwidth connectors. Literature review along with team experience helped the team identify potential risks and create a PCB industry survey on supplier capabilities for appropriate quality mitigation. Join the end-of-project webinar where we will review the survey results and highlight areas of expectations and gaps between the PCB fabricators and connector manufacturers. Additionally, the team will present quality assessment and dimension control recommendations. For additional information, contact Mark Schaffer (marks@inemi.org).
End-of-Project Webinar: AI Enhancement to AOI for PCBA, Phase 2(November 12 & 13) — Automated optical inspection (AOI) systems are essential in electronic manufacturing for ensuring the quality of printed circuit board assemblies (PCBA). Traditional AOI systems, however, face significant challenges due to high false call rates and defect escapes, particularly as electronic designs become more complex. The first phase of iNEMI’s AI Enhancement to AOI for PCBA Project aimed to evaluate and recommend AI technologies for AOI. Phase 1 of the project focused on surveying the current state of AI and AOI technologies in the industry, establishing common performance metrics, and preparing test vehicles for subsequent experiments. Phase 2 involved rigorous experimentation using the established metrics and test vehicles from Phase 1 to evaluate and validate the performance of AI-enhanced AOI systems. The end-of-project webinar will report the results and lessons learned from the project. Challenges and future work in adopting AI into AOI will also be discussed. For additional information, contact Haley Fu (haley.fu@inemi.org).
End-of-Project Webinar: High Density Interconnect Socket Warpage Prediction and Characterization, Phase 2 (December 5) — High-density interconnect (HDI) sockets, primarily designed for CPUs and GPUs, are shifting toward larger form factors as the number of interconnect pins increases. With large sockets, dynamic warpage prediction and control during reflow onto the printed circuit board is a significant challenge. Simulation is critical in the product development process, helping designers make the right design choices before significant investment in tooling and industrialization. Socket warpage prediction is now facing a few challenges. The majority of simulation computation is consumed by flow analysis in the pin hole region. An ability to speed up computation is desired to shorten socket design cycle. At the same time, accuracy of the simulation needs to be retained at an acceptable level. Phase 2 of iNEMI’s High Density Interconnect Socket Warpage Prediction and Characterization Project continued the work begun in Phase 1 of improving socket warpage simulation accuracy and further investigated the impact of molding materials and design on warpage for large sockets. This end-of-project webinar will report the results and lessons learned from Phase 2. For additional information, contact Haley Fu (haley.fu@inemi.org).
PAPER & PRESENTATIONS AVAILABLE
“IPEF Critical Materials Dialogue,” Mark Schaffer (iNEMI), third technical experts meeting of the IPEF Critical Minerals Dialogue on Recycling and Recovery (virtual meeting; September 10, 2024)
Packaging Interconnect Material Technology Series, presented by Dr. Kazuhiro Nogita(Nihon Superior Centre for the Manufacture of Electronic Materials and The University of Queensland). The following presentations and webinar recordings are available to members only:
