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CALL FOR SUBMISSIONS

WILL OPEN SOON!

The IEEE EMC Society is seeking original, unpublished papers covering all aspects of EMC, Signal/Power Integrity, and related technologies that are affected by EMC.

 
 
 
 

Please note the key dates below and

plan your submission accordingly.

 

It is my great pleasure to invite you to Portland, Oregon for the 2027 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI). This Symposium has long been the heartbeat of our community — a place where ideas spark, collaborations form, and friendships deepen. I am honored to help carry that tradition forward.


We are living through one of the most exciting periods in our field. From the electromagnetic challenges of electrified transportation and autonomous systems to the signal and power integrity demands of chiplet architectures and AI-scale computing, the problems we solve have never been more consequential — or more interconnected. These advances create new challenges and new opportunities for every one of us. The 2027 Symposium is where we will explore them together.


Share Your Work

If you have a story to tell — a breakthrough, a hard-won lesson, or even an open question — we want to hear it. We welcome proposals for Workshops, Tutorials, Experiments and Demonstrations, and Special Sessions, as well as individual submissions including full technical papers, abstract-reviewed papers, and poster presentations. The submission portal will open in October, 2026.


This year’s priority areas include:

  • Advanced Packaging EMC and SIPI — chiplets, 2.5D/3D integration, co-packaged copper and optics
  • AI/ML Applications to EMC and SIPI Problems
  • High-Speed SerDes, Die-to-Die, and Die-to-HBM Interconnects
  • Power Delivery and Integrity for Data Center and AI Infrastructure
  • Automotive and E-Mobility EMC
  • EMC for Aerospace, Defense, and Space


Of course, contributions across the full breadth of EMC and SIPI are equally welcome. Your perspective matters — do not hesitate to submit.


Come Learn and Connect

Whether you are here to present or to learn, this week has something for you. The Clayton R. Paul Global EMC University and Global SIPI University offer educational tracks for every career stage. "Ask the Expert" panels bring candid discussions with leaders in the field. Standards Week gives you a front-row seat to the standards shaping our industry — and a chance to get involved. Our exhibition floor will feature the latest tools and solutions from industry partners.


If you are a veteran of this Symposium or attending for the first time, you belong here. Some of the most meaningful moments happen between sessions — in the hallway conversations, over coffee, and at the social events that make this week special.


I cannot wait to welcome you to Portland, OR. Let's make EMC+SIPI 2027 one to remember.

Warmly,

Dr. Yansheng Wang

Technical Program Chair, 2027 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity (EMC+SIPI)

 
 
 
 

SUBMISSION KEY DATES

 

NOVEMBER 20, 2026

Submission Deadline for Special Session Proposals

DECEMBER 20, 2026

Submission Deadline for Traditional and Special Session Papers

JANUARY 15, 2027

Submission Deadline for Workshops & Tutorials and Experiments & Demonstrations Proposals

FEBRUARY 5, 2027

Notification of Acceptance/Rejection for Traditional and Special Session Papers

FEBRUARY 19, 2027

Submission Deadline for Abstract-Reviewed Papers

FEBRUARY 19, 2027

Notification of Acceptance/Rejection for Workshops & Tutorials and Experiments & Demonstrations

MARCH 5, 2027

Submission Deadline for Revised Traditional and Special Session Papers

APRIL 8, 2027

Notification of Acceptance/Rejection for Traditional, Abstract-Reviewed, and Special Session Papers

MAY 7, 2027

Submission Deadline for Final Papers and Workshop & Tutorial Presentations (Registration Required)

 
 
 

Questions? Contact us at symposiuminfo@emcss.org


2027.emcsipi.org

 

#IEEE_ESP27

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