Live Virtual Training

IEEE 370™-2020 Overview

A Robust Framework for Interconnect Characterization

14 March 2024 | 12:30 - 3:30 PM ET

Join us on 14 March 2024 for a live virtual training on IEEE 370 (Standard for Electrical Characterization of Printed Circuit Board and Related Interconnects at Frequencies up to 50 GHz). Learn how to use the "briefcase toolset" to investigate de-embedding situations with real-world examples using the proposed solutions by IEEE 370.

This will be a live training held via Zoom. You will receive the link upon registration. Please contact ieee-sa-events@ieee.org with any questions.



AGENDA & SPEAKERS

• Learn how IEEE 370 was developed
• Explore common industry problems and how IEEE 370 tackles them
• See an overview of the IEEE 370 toolset (“briefcase”) based on open-source software development
• Live Q&A

ABOUT IEEE 370

IEEE 370™-2020, Electrical Characterization of Printed Circuit Board and Related Interconnects at Frequencies up to 50 GHz, sponsored by IEEE EMC Society, was officially published on 08 January 2021. It provides standard and recommended practices for ensuring the quality of measured data for high-frequency electrical interconnect at frequencies up to 50 GHz. 

This might include, but is not limited to, recommending design of test fixtures, as well as methods and processes for ensuring the accuracy and consistency of measured data. Although the methods and techniques contained in the standard have been validated only to 50 GHz, the standard and general practice should be applicable for frequencies higher than 50 GHz as well. 

Sponsored by the IEEE EMC Society

The IEEE Electromagnetic Compatibility Society is the world’s largest organization dedicated to developing and distributing information, tools and techniques for reducing electromagnetic interference.

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