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September 2026 Issue

Call for Papers Deadlines


  • October 9, 2026 | 2027 7th Australian Microwave Symposium (AMS) | Call for Papers


  • October 11, 2026 | 2027 IEEE 7th International Symposium on Joint Communications & Sensing (JC&S) | Call for Papers


  • October 31, 2026 | 2027 3rd International Conference on Microwave, Antennas & Circuits (ICMAC) | Call for Papers



  • November 2, 2026 |2027 18th German Microwave Conference (GeMiC)| Call for Papers


See More MTT-S Sponsored Conferences

Upcoming Webinars


  • October 13, 2026 |RF Circuits and System Design from the Perspective of Waveform Level Signal Processing | Bayaner Arigong, Florida State University | Register Now


  • November 10, 2026 |Medical Radar – Understanding the Significance of Short-Range Propagation Effects | Mahmoud Wagih, University of Glasgow


See Upcoming MTT-S Webinars

Missed a webinar? Check out the IEEE Resource Center for archived webinars


Click to See Archived Webinars

 

Call for DML Applications

Deadline: March 15, 2027

The MTT-S each year carefully selects a group of Distinguished Microwave Lecturers (DMLs) who are internationally recognized experts and technical leaders in their fields within the Society.


The scope of the DML program is well known and has been very successful: we need excellent speakers on topics that are of interest to a broad audience. Please note that the DML talk is expected to differ from a typical expert technical talk, in that it must be specifically designed for broader audiences. Moreover, it is recommended that the DML selection be a balanced geographical representation of membership. Applicants in the IEEE Region 10, Latin America, and Africa are encouraged. Female applicants are also encouraged.


The DML program is intended to serve MTT-S chapter and student branch chapters through providing in-person and virtual DML talks. These chapters are surveyed biannually and a maximum of 1 in-person and 1 virtual talk can be provided by the program for an individual chapter. Talks at conferences can be supported if these are organized by a local MTT-S chapter and accessible free-of-charge to all MTT-S membership.


Learn More and

Apply to be a DML



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Technical Articles

 
Copyright © IEEE

A New Paradigm for Reconfigurable Intelligent Surface Design: Multiport Network Method

The proposed multiport network method is a new paradigm for reconfigurable intelligent surface (RIS) design that focuses on the structural design of the intelligent surface element. The proposed multiport network method offers a new paradigm for reconfigurable intelligent surface design, significantly improving design efficiency by replacing computationally expensive EM simulations. Each RIS element is discretized into an initial multiport structure with multiple patches connected by discrete ports which may be either passive or tunable. Optimization algorithms obtain the optimal load impedance parameters for the internal ports to find the most suitable structure for the element.

 
Copyright © IEEE

Multiport Analytical Pixel Electromagnetic Simulator (MAPES) for AI-Assisted Microwave Circuit and RFIC Design

This article proposes a novel analytical framework, denoted the multiport analytical pixel electromagnetic simulator (MAPES). MAPES enables efficient and accurate prediction of the electromagnetic (EM) performance of arbitrary pixel-based microwave (MW) and radio frequency integrated circuit (RFIC) structures. Unlike the internal multiport method (IMPM), which optimizes only connecting elements within a fixed, gap-separated pixel skeleton, MAPES operates directly on the all-pixel presence/absence formulation used in recent MW/RFIC design. By introducing virtual pixels and diagonal virtual pixels and inserting virtual ports at critical positions, MAPES captures all horizontal, vertical, and diagonal EM couplings within a single multiport impedance matrix. Only a small set of full-wave is needed to construct this matrix. MAPES provides a practical and versatile tool for AI-assisted MW & RFIC design across diverse technologies.

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MTT-S News and Announcements

Calling All Students:

Apply For IEEE MTT-S Graduate and

Undergraduate/Pre-graduate Fellowships Today

Become an MTT-S Outstanding YP Lecturer!

MTT-S Volunteer Spotlight

Strengthening Global Participation With Regional Engagement and Student Empowerment: An Overview of IEEE MTT-S Broadening Participation Efforts in 2025

The MTT-S BPC was established in 2025 in accordance with IEEE directives. In early 2025, the committee was known as the Collaboration and Engagement Committee (CEC); several figures in this article therefore retain the CEC label from materials created before the name changed to BPC in mid-2025. The committee was created to strengthen MTT-S engagement in regions where participation has been limited and to broaden access to professional development and mentoring opportunities across the global MTT-S community. Through regional workshops, technical keynotes, panel discussions, mentoring sessions, student competitions, and industry–academia engagement, the 2025 BPC initiatives connected emerging regions with the wider MTT-S network while empowering students, young professionals, faculty, and industry partners to participate more actively in the Society’s technical and professional activities.


The MTT-S BPC expanded global participation in 2025 through regional workshops and outreach activities. The initiatives emphasized local partnerships, emerging-region engagement, and broader connections across the global MTT-S community. Programs included expert technical keynotes, BPC panels, industry–academia collaboration sessions, student mentoring, and technical skill development. Student-focused activities featured Three-Minute Presentation Competitions (3MPCs), awards, certificates, recognition, and professional networking opportunities.


Read the full article

Humanitarian Technology and Community Innovation:

IEEE MTT-S SIGHT Session at MIKON, MRW 2026

The Special Interest Group on Humanitarian Technology (SIGHT) within the IEEE Microwave Theory and Technology Society (MTT-S) continues to create meaningful platforms where technology, innovation, and social responsibility converge to address real-world societal challenges. As part of this vision, a dedicated SIGHT Workshop was organized as a part of the Microwave and Radiolocation Foundation (MIKON) during Microwave and Radar Week (MRW) 2026 in Kraków, Poland. The session brought together researchers, IEEE volunteers, students, and professionals to discuss how humanitarian technology initiatives can support local communities, encourage sustainable innovation, and create opportunities for young innovators and start-ups.


The program commenced with an address by Prof. Chinmoy Saha, chair of IEEE MTT-S SIGHT, vice chair of IEEE MTT-S Member and Geographic Activities (MGA), and a professor at the Indian Institute of Space Science and Technology. His talk, titled “Spectrum of Opportunities Through MTT-S SIGHT,” highlighted the expanding role of IEEE humanitarian initiatives in education, health-care, accessibility, and technology outreach activities across various communities. He further emphasized the importance of collaborative innovation and volunteer-driven activities capable of generating sustainable social impact through technology.


Read the full article

Do you have a friend or colleague who is doing great things as an MTT-S Volunteer? Nominate them to be featured in the e-newsletter volunteer spotlight! Click the button below:

 

Technical Articles

 
Copyright © IEEE

Automated Broadband Power Amplifier Design via Circuit-Graph Evolution and Layout-Aware Synthesis

This article presents an automated design framework for broadband power amplifiers (PAs) based on a graph-driven evolutionary optimization approach. In the proposed framework, the input and output matching networks are represented as graphs and jointly synthesized in both the topology and parameter spaces to optimize the small- and large-signal performance of the PA. This approach enables the automated synthesis of physically realizable broadband source and load impedance trajectories without relying on predefined circuit templates. In addition, a graph-to-layout generation methodology is introduced to automatically translate the evolved circuit graphs into manufacturable layouts while incorporating electromagnetic (EM)-aware optimization. The proposed framework is experimentally validated through the design and fabrication of a 10-W GaN PA operating from 3.2 to 4.3 GHz and supporting 1 GHz instantaneous modulation bandwidth across the 5G NR n77 band.

 
Copyright © IEEE

Automated Design of Ultracompact Broadband Power Amplifiers Using Polygonal Evolution

This letter proposes an automated synthesis framework for compact broadband power amplifiers (PAs), driven directly by large-signal electromagnetic (EM) circuit cosimulation. To break the rigid geometric restrictions of conventional rectangular topologies while avoiding the self-intersections typical of unconstrained designs, a partially constrained parametric polygonal framework is proposed under a strict footprint boundary. This technique intrinsically realizes adaptive layout meandering to ensure both miniaturization and fabrication reliability. For validation, a 0.7–3.1-GHz broadband PA is fabricated. Measurements demonstrate a 41.9-dBm maximum output power (Pout) and a 72.9% peak drain efficiency (DE). Notably, the PA occupies an ultracompact footprint of 36×58 mm2.

 

Upcoming Events

 

EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Electronics Packaging Society, IEEE Microwave Theory and Techniques Society, and IEEE Antenna and Propagation Society.

The International Microwave & Antennas Symposium (IMAS) 2026 is a flagship IEEE conference bringing together global experts in microwave, antennas, and electromagnetic technologies. The event will spotlight the latest advancements in wireless communication, radar, and sensing. With a strong focus on industry-academia collaboration, IMAS 2026 offers a unique platform for knowledge exchange, networking, and strategic partnerships.


Editorial Board

Editor-in-Chief

Joel Arzola

Raytheon


Managing Editor

Amanda Scacchitti

The Albero Agency, Inc

 
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