APPLICATIONS:

Fluorine Etch Processes (SF6, CF4, CHF3, O2): Carbon, Si, Epoxy, SiO2, InSb, Si3N4, Ir, SiC, Mo, Ta, Nb, TaN, OxyNitride, TiW, Polyimide, TiN, Pr (examples: SiLK or SU8), W, Quartz.

OPTIONS INCLUDE:

• Electrostatic chuck (E-chuck) to more effectively keep the wafer cool during the etch process, using a helium pressure controller to build up a cooling layer of helium on the backside of the wafer.
• Inductively coupled plasma (ICP) to create higher-density plasma, thereby increasing etch rates and anisotropy.

Trion offers custom carriers. Shown here are examples: single-wafer and four-wafer carriers designed for processing 100 mm wafers on 300 mm chuck etching systems.

TRION BENEFITS:

• Full process support both prior and subsequent to purchase.
• Worldwide sales and service offices.
• Dedicated on-site Trion Machine Shop offers quick customization and a fast turn-around time.
• Trion is a private, USA-based company with 30+ years of industry experience.

UPCOMING EVENTS ... See you at the show!

Join us at the 2026 Florida Semiconductor Summit, Feb 23-25, 2026, at the Rosen Shingle Creek in Orlando, FL, USA! We look forward to meeting you at our Booth # 117. 

Trion Technology Website | Email: info@triontech.com | Telephone: +1 727 461 1888