By Dr. Cong Li, Senior Power Electronics Engineer and EMC Lead

Abstract: This webinar provides engineers with techniques to develop and construct electromagnetically compatible Wide Bandgap (WBG) power electronic converters used in aviation applications. Real-world examples and issues are demonstrated with high frequency construction methods necessary to meet the electromagnetic compatibility (EMC) requirements. The webinar provides fundamental EMC theory for silicon carbide (SiC) power electronics, a new “SOLVE” EMC design flow for WBG power converters, and practical design, construction, and measurement techniques.

Speaker Bio: Dr. Cong Li (S’09-M’15-SM’19) received the Ph.D. degree in electrical engineering specializing in power electronics from The Ohio State University, Columbus, OH, USA, in 2014. He joined GE Global Research Center at Niskayuna, NY, USA as a Research Engineer in 2014 and is currently a Senior Power Electronics Engineer and EMC Lead. His research interests include power electronics topologies, WBG devices, high density high power SiC converters for automotive and aviation applications, and EMI mitigation techniques. He has authored dozens of technical papers as well as patent applications in the area of power electronics and EMC. He is a voting member of the commercial aviation DO-160 standard working group. He is currently a Senior Member of IEEE, Associate Editor at IEEE Open Journal of Power Electronics and IEEE Transactions on Industry Applications. Regarding his work with industry associations, Dr. Li is secretary of IEEE-IAS-IPCSD-Power Electronics Devices & Components Committee (PEDCC), secretary of IEEE-EMCS-SC5 Power Electronics EMC, as well as Technical Committee member of IEEE APEC, ECCE, and ITEC conferences. He is a member of SAE and AIAA, and the recipient of the 2019 Promising Professional Award from the Society of Asian Scientists and Engineers (SASE).

Next up? Are you interested in learning more about recent advancements in EMC, Signal and Power Integrity technologies? If so, join us virtually July 26-August 20 for the 2021 JOINT IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, SIGNAL & POWER INTEGRITY, AND EMC EUROPE.

Register today to hear over 200 papers, choose from over 40 workshops and tutorials to attend, sit in on four Ask the Experts panels, and more! 

Of special note, IBIS will host one of the Ask the Experts panels, present a paper session titled “IBIS Based Power Integrity Modeling” AND conduct the popular IBIS Summit during the symposium.