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Join us for our next webinar! September 16, 2026, 8:30 -11:30 am Pacific time (California) Cost $300 per person. Group discounts available! Please note, this webinar will be recorded. If the time is not convenient for you, this webinar can be purchased to view at your leisure. Contact us for more details.
Register here and pass this on to your co-workers!
This 3-hour webinar is an overview of his 2-day seminar and will focus on these three topics:
• To understand how variations in coefficients of thermal expansion (CTE) can affect the magnitude of the displacements, forces, and stresses that are developed in electronic assemblies during thermal cycling environments and how these factors affect fatigue life.
• To understand how resonant conditions can affect dynamic displacements, forces and stresses in electronic assemblies during different sine and random vibration environments.
• To understand the concept of "damage accumulation" and how it can be used to determine the approximate fatigue life of various electronic assemblies due to different combinations of fatigue accumulated in thermal cycling and vibration environments.
This course is based upon the popular book Preventing Thermal and Vibration Failures in Electronic Equipment by Prof. Dave Steinberg.
WHO SHOULD ATTEND?
R&D Electronic Engineers and Managers
Packaging Engineers
Quality & Reliability Engineers
Test Engineers
Manufacturing Engineers
Mechanical Engineers
Application and Sale Engineers
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